Thermal energy management and reliability physics challenges in electronic / photonic devices and systems; lead-free solder; vibrational energy harvesting
Dr. Jeff Punch is the Director of Stokes Laboratories at the University of Limerick (UL) – a research organisation dedicated to education and innovation in mechanical engineering science. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic, photonic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics. He has won €8 million in industrial and research funding to date, and he is currently supervising nine postgraduate students and mentoring three postdoctoral researchers. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.
Waddell, A.M., Punch, J., Stafford, J. and Jeffers, N., 2015, “The Flow Structure and Heat Transfer Performance of an Oblique Impinging Jet Generated in a Square Miniature Channel” Journal of Visualization, doi: 10.1007/s12650-015-0305-y.
O’Connor, J., Punch, J., Jeffers, N. and Stafford, J., 2015, “A Comparison of the Dimensional and Hydrodynamic Characteristics of 3D-Printed and Silicon Microchannels”, Microfluidics & Nanofluidics, doi: 10.1007/s10404-015-1569-1.
Waddell, A.M., Punch, J., Stafford, J. and Jeffers, N., 2015, “On the Hydrodynamic Characterization of a Passive Shape Memory Alloy Valve”, Applied Thermal Engineering, Vol. 75, pp. 731–737 doi: 10.1016/j.applthermaleng.2014.09.073.
Mac Giolla Eain, M., Egan, V. and Punch, J., 2015, “Local Nusselt Number Enhancements in Liquid-Liquid Taylor Flows”, International Journal of Heat and Mass Transfer, Vol. 80, pp. 85-97, doi: 10.1016/j.ijheatmasstransfer.2014.09.009.
Punch, J. and Walsh, E. eds., 2014, Eurotherm Seminar 102: Thermal Management of Electronic Systems, Limerick, Ireland, 18-20 Jun 2014. published online in Journal of Physics: Conference Series, 525, http://iopscience.iop.org/1742-6596/525/1.
Mac Giolla Eain, M., Egan, V., Howard, J., Walsh, P., Walsh, E. and Punch, J., 2015, “Review and Extension of Pressure Drop Models applied to Taylor Flow Regimes”, International Journal of Multiphase Flow, Vol. 68, pp 1-9, doi: 10.1016/j.ijmultiphaseflow.2014.09.006.
Cottone, F., Frizzell, R., Goyal, S., Kelly, G. and Punch, J., 2014, “Enhanced Vibrational Energy Harvester Based On Velocity Amplification Effect”, Journal of Intelligent Material Systems and Structures, Vol. 25, No. 4, pp. 443-451, doi: 10.1177/1045389X13498316.
Burke, C. and Punch, J., 2014, “A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys”, IEEE Transactions on Components, Packaging and Manufacturing Technologies, Vol. 4, No. 3, pp. 516-527, doi: 10.1109/TCPMT.2014.2299400.
Mac Giolla Eain, M., Egan, V. and Punch, J., 2013, “Film Thickness Measurements in Liquid-Liquid Slug Flow Regimes”, International Journal of Heat and Fluid Flow, Vol. 44, pp. 515-523, doi: 10.1016/j.ijheatfluidflow.2013.08.009.
Herkommer, D., Punch, J. and Reid, M., 2013, “Constitutive Modelling of Joint-Scale SAC Solder Shear Samples”, IEEE Transactions on Components, Packaging and Manufacturing Technologies, Vol. 3, Iss. 2, pp. 275-281, doi: 10.1109/TCPMT.2012.2227481.
Breen, T.J., Walsh, E.J., Punch, J., Shah, A.J., Bash, C.E., Kumari, N. and Cader, T., 2012, “From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency”, Journal of Electronic Packaging, Vol. 134, Iss. 4, pp. 041009.1-8, doi: 10.1115/1.4007744.
Breen, T.J., Walsh, E.J., Punch, J., Shah, A.J., Bash, C.E., Rubenstein, B., Heath, S. and Kumari, N. 2012, “From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency”, Journal of Electronic Packaging, Vol. 134, Iss. 4, pp. 041006.1-9, doi: 10.1115/1.4007110.
Collins, M.N., Punch, J. and Coyle, R., 2012, “Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors”, Journal of Soldering & Surface Mount Technology, Vol. 24, Iss. 4, pp.240 – 248, doi: 10.1108/09540911211262520.
Reid, M., Collins, M.N., Dalton, E., Punch, J. and Tanner D., 2012, “Testing Method for Measuring Corrosion Resistance of Surface Mount Chip Resistors”, Microelectronics Reliability, 52, Iss. 7, July, pp. 1420-1427, doi: 10.1016/j.microrel.2012.02.020.
Hannigan, K., Reid, M., Xu, Collins, M.N., Dalton, E., Xu, C., Wright, B., Demirkan, K., Opila, R. L., Reents, W.D. Jr., Franey, J.P., Fleming, D.A. and Punch J., 2012, “Corrosion of RoHS Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environment”, Journal of Electronic Materials, Vol. 41, No. 3, pp. 611-623, doi: 1007/s11664-011-1799-2.